Multi-die chips, known as three-dimensional integrated circuits, or 3D-ICs, represent a revolutionary step in semiconductor design. The chips are vertically stacked to create a compact structure that boosts performance without increasing power consumption.
However, as chips become denser, they present more complex challenges in managing electromagnetic and thermal stresses. To understand and address this, advanced 3D multiphysics visualizations become essential to design and diagnostic processes.
At this week's Design Automation Conference, a global event showcasing the latest developments in chips and systems, Ansys - a company that develops engineering simulation and 3D design software - will share how it's using NVIDIA technology to overcome these challenges to build the next generation of semiconductor systems.
To enable 3D visualizations of simulation results for their users, Ansys uses NVIDIA Omniverse, a platform of application programming interfaces, software development kits, and services that enables developers to easily integrate Universal Scene Description (OpenUSD) and NVIDIA RTX rendering technologies into existing software tools and simulation workflows.
The platform powers visualizations of 3D-IC results from Ansys solvers so engineers can evaluate phenomena like electromagnetic fields and temperature variations to optimize chips for faster processing, increased functionality and improved reliability.
With Ansys Icepak on the NVIDIA Omniverse platform, engineers can simulate temperatures across a chip according to different power profiles and floor plans. Finding chip hot-spots can lead to better design of the chips themselves, as well as auxiliary cooling devices. However, these 3D-IC simulations are computationally intensive, limiting the number of simulations and design points users can explore.
Using NVIDIA Modulus, combined with novel techniques for handling arbitrary power patterns in the Ansys RedHawk-SC electrothermal data pipeline and model training framework, the Ansys R&D team is exploring the acceleration of simulation workflows with AI-based surrogate models. Modulus is an open-source AI framework for building, training and fine-tuning physics-ML models at scale with a simple Python interface.
With the NVIDIA Modulus Fourier neural operator (FNO) architecture, which can parameterize solutions for a distribution of partial differential equations, Ansys researchers created an AI surrogate model that efficiently predicts temperature profiles for any given power profile and a given floor plan defined by system parameters like heat transfer coefficient, thickness and material properties. This model offers near real-time results at significantly reduced computational costs, allowing Ansys users to explore a wider design space for new chips.
Ansys uses a 3D FNO model to infer temperatures on a chip surface for unseen power profiles, a given die height and heat-transfer coefficient boundary condition. Following a successful proof of concept, the Ansys team will explore integration of such AI surrogate models for its next-generation RedHawk-SC platform using NVIDIA Modulus.
As more surrogate models are developed, the team will also look to enhance model generality and accuracy through in-situ fine-tuning. This will enable RedHawk-SC users to benefit from faster simulation workflows, access to a broader design space and the ability to refine models with their own data to foster innovation and safety in product development.
To see the joint demonstration of 3D-IC multiphysics visualization using NVIDIA Omniverse APIs, visit Ansys at the Design Automation Conference, running June 23-27, in San Francisco at booth 1308 or watch the presentation at the Exhibitor Forum.
Most recent headlines
05/01/2027
Worlds first 802.15.4ab-UWB chip verified by Calterah and Rohde & Schwarz to be ...
04/08/2026
Dalet, a leading technology and service provider for media-rich organizations, t...
04/07/2026
April 7 2026, 19:00 (PDT) Detective Conan: Fallen Angel of the Highway Opens in...
01/06/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
01/06/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
01/06/2026
Marshall Electronics is showcasing a comprehensive lineup of next-generation POV cameras, purpose-built to power today's connected AV environments, at InfoC...
01/06/2026
Adobe Announces Concept to Vector
Deepa Subramaniam June 1, 2026
0 Comments
One of the biggest frustrations we hear from designers is how difficult it...
01/06/2026
Vampire Feature Night Patrol Graded with DaVinci Resolve Studio
Brie Clayton June 1, 2026
0 Comments
Colorist shapes dark, gritty tone for horror thri...
01/06/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
01/06/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
01/06/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
01/06/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
01/06/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
01/06/2026
Mardi 2 juin 14h00
FilmLight (ARRI), 10 rue Ren Boulanger, 75010 Paris
Rejoignez-nous pour d couvrir comment FLAPI (l'API FilmLight) peut transformer e...
01/06/2026
January 6 2026, 05:30 (PST) Dolby Sets the New Standard for Premium Entertainment at CES 2026
Throughout the week, Dolby brings to life the latest innovatio...
31/05/2026
Olivia P rez-Collellmir to Premiere Original Work at Gaud Centennial in Barcelona The Berklee graduate and faculty member will debut her choral symphony with...
31/05/2026
Back to All News
Netflix Wins 15 Awards at the Canadian Screen Awards - See Pho...
31/05/2026
Taiwan is home to more than 500 NVIDIA ecosystem partners. More than 1 million N...
31/05/2026
As factories move from isolated automation to plant-wide intelligence, manufacturers need AI systems that can connect live machine signals, quality systems, wor...
31/05/2026
The NVIDIA AI Cloud ecosystem is accelerating the global buildout of AI factory infrastructure. Partners are expanding capacity to meet growing demand from ente...
30/05/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
30/05/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
30/05/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
30/05/2026
Zero in on one that says yes (and no)
Andy Marken May 29, 2026
0 Comments
Hero image courtesy of Deposit Photos
For content creators the most difficu...
29/05/2026
With InfoComm 2026 just weeks away, NDI is giving attendees plenty of reasons to...
29/05/2026
Reaffirming a partnership that has defined Canadian sports broadcasting since 19...
29/05/2026
Mobile/tablet is No. 2 device for watching TV, suggesting that the sports-production industry needs to take another look at the format
Ring Digital's Sprin...
29/05/2026
Berliner Ensemble, one of Berlin's five major theater companies, has expande...
29/05/2026
Solid State Logic will showcase its new compact, fly-away TCA Tour audio product...
29/05/2026
Gerald (Jerry) Pierce, a pioneering technologist who helped shape the digital transformation of the motion picture industry, passed away last month on April 12 ...
29/05/2026
Paramount+ will be the English-language U.S. home for Barclays Women's Super...
29/05/2026
Further strengthening its virtualisation strategy to fully support broadcasters ...
29/05/2026
Swiss broadcaster Canal Alpha has deployed Harmonic's award-winning, software-based XOS Advanced Media Processor to modernize playout operations across cant...
29/05/2026
PTZOptics will showcase a new generation of intelligent video workflows at InfoComm 2026, June 17-19, Las Vegas. Visitors to booth N8227 will see how PTZOptics ...
29/05/2026
Arizona's Family has launched the Arizona's Family Sports (AZFS) streaming app, a new direct-to-consumer destination for live, local sports. The app is ...
29/05/2026
Starting in 2027, DAZN will be the exclusive home of The Canadian Football Leagu...
29/05/2026
Comcast Business has detailed the advanced network infrastructure it has deploye...
29/05/2026
In two-day event, leaders from academia and industry explored solutions to chall...
29/05/2026
The Basketball Tournament (TBT), now entering their 13th year of competition, ha...
29/05/2026
Roku has launched FOX One as a Premium Subscription on The Roku Channel in the U.S. Roku customers can now subscribe to FOX One using their Roku account for liv...
29/05/2026
In its sixth year, the broadcaster's coverage has become a global brand and ...
29/05/2026
Ratings Roundup is a rundown of recent ratings news and is derived from press re...
29/05/2026
The days are getting longer, the temperatures are rising, and playlists are filling up for the season. With summer around the corner, Spotify's global edito...
29/05/2026
New retro-inspired MPC announced
There are few devices that have gained the status held by Akai Pro's MPC range, and in recent years, the company have s...
29/05/2026
Save up to 30 on acclaimed titles
Following a successful launch at Superbooth 2026, Bjooks have revealed that they will be continuing the Kickstarter campa...
29/05/2026
Binaural monitoring application improved
Genelec have just released an update that brings some powerful new features to their HRTF-based binaural headphone ...
29/05/2026
6 June 2026 at SAE Institute, London, UK
IMSTA FESTA 2026 is almost upon us, with some of the biggest names in pro-audio set to descend upon SAE Institute i...
29/05/2026
Gerald (Jerry) Pierce, a pioneering technologist who helped shape the digital transformation of the motion picture industry, died April 12, 2026, at his home in...
29/05/2026
Share
Copy link
Facebook
X
Linkedin
Bluesky
Email...
Multi-die chips, known as three-dimensional integrated circuits, or 3D-ICs, represent a revolutionary step in semiconductor design. The chips are vertically stacked to create a compact structure that boosts performance without increasing power consumption.
