Nefelus Selects Aspera, an IBM Company, to Accelerate the Transfer of Big Data to Speed Computer Chip Design

SAN FRANCISCO, Calif. - DAC 2014, Booth 300 - June 3, 2014-IBM (NYSE: IBM) today announced that Nefelus, a provider of integrated circuit (IC) design tools, has selected Aspera, an IBM company and creators of software that moves the world's data at maximum speed, to speed the transfer of extremely large design files to, from and through the cloud. This enables IC designers to quickly and securely move proprietary files - which can exceed 10 gigabytes in size - to the Nefelus cloud platform, where they can access powerful third-party tools to accelerate semiconductor and chip design projects.

IC design companies play a critical role developing the computer chips that power everything from enterprise servers to mobile devices. However, upfront technology and infrastructure investments in the latest design tools, as well as access to scalable computing power to support intensive design work, present a difficult challenge for these companies to stay competitive in the market. The combination of Nefelus and Aspera helps solve these challenges with cloud-based tools and scalable computing resources supported by Aspera's high speed transfer of large files between design teams.

With Aspera On Demand, designers now have a simple and secure way to deliver large files to the Nefelus platform from anywhere in the world while reducing transfer times by up to 99 percent. Once on the Nefelus platform, designers have access to leading Electronic Design Automation (EDA) tools in a managed cloud environment. Nefelus also allows users to take advantage of high-performance computing capacity for intensive design tasks with advanced collaboration capabilities that make it easier for global teams to connect and share knowledge to fuel innovation.

For example, a designer can access the Nefelus web portal and upload their design files with Aspera's Connect Web Browser Plug-in. Once the transfer is complete, designers can select from a full library of design tools provided by third-party vendors in the Nefelus marketplace and work on the project with team members around the world. Once the work is complete, the designer initiates a fast and secure download via Aspera to transfer the output files back to a local system.

The combination of Nefelus' innovative cloud platform and Aspera's high speed transfer technology is changing how IC designers and organizations can collaborate across long distances, said Dimitris Fotakis, founder and CEO, Nefelus. Aspera is the trusted provider of file transfer technologies, ensuring the fast and secure delivery of intellectual property to and through the cloud. The combination of Nefelus and Aspera is helping remove the traditional barriers to entry in the semiconductor industry.

Nefelus is a great example of the type of industry transformation that Aspera enables, said Richard Heitmann, vice president of marketing, Aspera. By leveraging the cloud for web-based collaboration and a usage-based model for design tools, Nefelus and Aspera are empowering the next generation of IC designers in the integrated semiconductor industry to drive innovation.

Today's announcement extends IBM's leadership in Big Data and Analytics, including $24 billion invested in new software and services capabilities since 2005. To learn more about Aspera's solutions for the EDA industry, visit us at DAC in San Francisco, June 1-5, 2014, at Booth 300.

About Nefelus

Nefelus provides a cloud-based software service to expedite design tasks in electronic chip design. The service offers all the mechanisms necessary for end-users to perform isolated design tasks and task flows. Nefelus also provides the hardware infrastructure required to execute complex tasks as well as the tools and tool setups required for their execution. It is available to end users 24/7 as a turnkey service with no setup requirements. For more information, please visit https://www.nefelus.com/

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