SAN JOSE, Calif., May 21, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced that Xilinx and Sumitomo Electric Industries, Ltd. are collaborating to bring smarter solutions to market. These solutions reduce CapEx and OpEx costs through the use of Sumitomo Electrics Gallium Nitride (GaN) power amplifier transistors and Xilinx SmartCORE IP that result in higher radio unit efficiencies. Wireless system designers using Xilinxs SmartCORE IP can scale to support small cells to high-end macro cells, as well as active antenna systems (AAS), offering customers time-to-market advantages, lower development costs, high efficiency, lower SWaP (size, weight and power), and lower total cost.
(Logo: http://photos.prnewswire.com/prnh/20020822/XLNXLOGO)
Xilinx radio SmartCORE IP such as Digital Up and Down Converters (DUC/DDC), Crest Factor Reduction (CFR) and Digital Pre-Distortion (DPD) IP cores, coupled with generation-ahead 28nm Zynq -7000 All Programmable SoCs, offers customers a single-chip implementation of the entire digital radio in addition to board level control and calibration typically found in an external processor.
By collaborating with Sumitomo Electric, we are able to provide our customers with a smarter solution that is scalable to support the needs of broadband microcells, and up to the highest performance multi-antenna broadband macros and AAS installations, said David Hawke, director of wireless product marketing at Xilinx. Additionally, our radio IP, coupled with Sumitomo Electrics power amplifier transistors, allow OEMs to design equipment that ultimately save operator CapEx and OpEx, as well as reduce device cost and power.
The high breakdown voltage and saturation velocity characteristics of GaN devices make it an ideal candidate for high-power and high-temperature base station applications. The higher power density of GaN also allows for smaller devices, reducing size and cost.
Sumitomo Electrics GaN-based power devices combined with Xilinxs SmartCORE IP will demonstrate the worlds next generation of highly efficient solutions for the wireless market, said Nobu Kuwata, general manager of Technology and Marketing Strategy Department at Sumitomo Electric Device Innovations, Inc. Sumitomo Electric is committed to developing the products necessary to meet the requirements of our customers offering smarter solutions.
Please visit the Sumitomo Electric booth (#2120) at the International Microwave Symposium 2013 (IMS) in Seattle on June 4-6, 2013 to see a live demonstration of the Sumitomo Electric GaN and Xilinx DPD IP core.
Availability
Visit the Sumitomo Electric website for technical detail and purchase information for its GaN power amplifier transistors. To learn more about the Xilinx radio IP, visit: http://www.xilinx.com/esp/wireless/refdes_listing.htm.
About Xilinx
Xilinx is the worlds leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
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Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.
Xilinx
Silvia E. Gianelli
(408) 626-4328
silvia.gianelli@xilinx.com
SOURCE Xilinx, Inc.
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SAN JOSE, Calif., May 21, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced that Xilinx and Sumitomo Electric Industries, Ltd. are collaborating to bring smarter solutions to market. These solutions reduce CapEx and OpEx costs through the use of Sumitomo Electrics Gallium Nitride (GaN) power amplifier transistors and Xilinx SmartCORE IP that result in higher radio unit efficiencies. Wireless system designers using Xilinxs SmartCORE IP can scale to support small cells to high-end macro cells, as well as active antenna systems (AAS), offering customers time-to-market advantages, lower development costs, high efficiency, lower SWaP (size, weight and power), and lower total cost.
