Rohde & Schwarz to reach LTE-A carrier aggregation Cat6 IP roughput using R&S CMW500

Rohde & Schwarz to reach LTE-A carrier aggregation Cat6 IP throughput using R&S CMW500 Munich, Nov 08, 2013 - Rohde & Schwarz and HiSilicon have successfully implemented the requirements for device category 6 (Cat6) in compliance with 3GPP Release 10 for LTE-Advanced. Jointly, the companies have performed tests on a HiSilicon Balong720, the world's first Cat6 chipset solution. Balong720 supports the aggregation of two component carriers each with a bandwidth of 20 MHz in the downlink and achieves data rates of 300 Mbps.

For the test setup, the R&S CMW500 wideband radio communication tester from Rohde & Schwarz was used in callbox mode and as protocol tester. The test platform was equipped with options for RF tests, protocol tests and end-to-end tests for LTE-Advanced carrier aggregation. It is the only one-box RF test solution on the market that allows measurements with two component carriers in the downlink, including 2x2 and 4x2 MIMO, without restricting the bands and bandwidths that are used. The R&S CMW500 also provides the necessary performance for the required 300 Mbps data rate on the IP level for Cat6 in the downlink.

With this achievement, Rohde & Schwarz and HiSilicon contribute to the progress of the entire supply chain and speed up the commercial launch of LTE-Advanced carrier aggregation functionality. Until now, scenarios for LTE-Advanced carrier aggregation were usually implemented with two component carriers, each with a 10 MHz bandwidth and 150 Mbps total data rate in the downlink (category 4). Device category 6 will make it possible to double this data rate.

The options for RF tests and protocol tests for LTE-Advanced downlink carrier aggregation for LTE FDD as well as LTE TDD are now available from Rohde & Schwarz.

Rohde & SchwarzRohde & Schwarz is an independent group of companies specializing in electronics. It is a leading supplier of solutions in the fields of test and measurement, broadcasting, radiomonitoring and radiolocation as well as secure communications. Established 80 years ago, Rohde & Schwarz has a global presence and a dedicated service network in over 70 countries. It has approx. 9300 employees and achieved a net revenue of 1.9 billion (USD 2.5 billion) in fiscal year 2012/2013 (July 2012 to June 2013). Company headquarters are in Munich, Germany.

R&S is a registered trademark of Rohde & Schwarz GmbH & Co. KG

HiSilicon

HiSilicon Technologies is a leading chipset solution provider for wireless terminal, telecom network and consumer electronics. It is headquartered in Shenzhen, China. HiSilicon chipsets are now serving more than 200 global operators in over 100 countries.

LINK:	http://www.rohde-schwarz.co.uk/en/News_Events/Press_Releases/press-Roh...
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